Nvidia Looks to Accelerate Production With New Packaging Tech from gc online plus login panel Watch Video

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✓ Published: 30-May-2024

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Nvidia Looks to , Accelerate Production , With New Packaging Technology.<br/>Yahoo Finance reports that Nvidia Corp has announced <br/>plans to use Fan-Out Panel Level Packaging (FOPLP) <br/>technology to package its GB200 AI server chips.<br/>The change was reportedly made to address production constraints <br/>on the currently used Chip on Wafer Substrate (CoWoS) packaging <br/>used at the Taiwan Semiconductor Manufacturing Company.<br/>The change was reportedly made to address production constraints <br/>on the currently used Chip on Wafer Substrate (CoWoS) packaging <br/>used at the Taiwan Semiconductor Manufacturing Company.<br/>According to industry experts, FOPLP <br/>could be a viable alternative to CoWoS <br/>amid the increasing demand for AI chips. .<br/>Analysts consider Nvidia the premier accelerated <br/>compute and generative AI supplier, backed <br/>by production plans with Blackwell Chip. .<br/>Over the past year, stock in <br/>Nvidia has gained over 184%. .<br/>On May 29, shares in Nvidia were up <br/>0.89% at $1,149.10 in premarket trading. .<br/>Yahoo Finance reports that a growing <br/>number of packaging companies are <br/>getting ready to offer FOPLP services. .<br/>Yole Group has predicted that <br/>its market share will increase <br/>from 2% in 2022 to 8% by the year 2028.<br/>The gains are expected to primarily <br/>be driven by higher yields and <br/>increasing cost efficiency.<br/>Experts point out that while FOPLPs could reduce cost <br/>and expand capacity, they have weaker technical <br/>specifications compared to the current CoWoS standard